| Sn-Zn系无铅钎料的研究现状及发展趋势 |
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| 引用本文： | 王慧,薛松柏,韩宗杰,王俭辛. Sn-Zn系无铅钎料的研究现状及发展趋势[J]. 焊接, 2007, 0(2): 31-35 |
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| 作者姓名： | 王慧 薛松柏 韩宗杰 王俭辛 |
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| 作者单位： | 南京航空航天大学,210016 |
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| 基金项目： | 江苏省六大人才高峰基金 |
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| 摘 要： | 介绍了Sn-Zn系无铅钎料的研究及应用现状,阐述了为改善Sn-Zn无铅系钎料存在的不足之处,添加各种合金元素或微量元素如Bi,Ag,In,Ga,Al,RE等元素后,对Sn-Zn系无铅钎料钎焊性能、力学性能的影响以及Sn-Zn系无铅钎料界面反应及界面金属间化合物(IMC)的研究现状.简要综述了国内外有关Sn-Zn系无铅钎料专用助焊剂的研究状况,对Sn-Zn系无铅钎料今后的研究、改进及应用方面的前景和发展方向进行了分析与预测.
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| 关 键 词： | 无铅钎料 Sn-Zn 合金元素 润湿性 金属间化合物 |
| 修稿时间： | 2006-11-25 |
Research status and prospect of Sn-Zn based lead-free solders |
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| Wang Hui,Xue Songbai,Han Zongjie,Wang Jianxin. Research status and prospect of Sn-Zn based lead-free solders[J]. Welding & Joining, 2007, 0(2): 31-35 |
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| Authors: | Wang Hui Xue Songbai Han Zongjie Wang Jianxin |
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| Abstract: | Application and research status of Sn-Zn based lead-free solders were introduced and the effect of different alloy elements added toSn-Zn based lead-free solders on the solderability of the solders, mechanical properties of soldered joints and characteristics of intermetalliccompounds formed at the interface of Sn-Zn based lead-free solders and substrate were also summarized respectively. More ever, the fluxesused with Sn-Zn based lead-free solders were reviewed, and at the same time, the prospect and direction for developing novel Sn-Zn soldersand fluxes were also previewed briefly. |
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| Keywords: | lead-tree solder Sn-Zn alloy element wetting property intermetallic compound |
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