Review of methods to predict solder joint reliability under thermo-mechanical cycling

Solder joints are often the cause of failure in electronic devices, failing due to cyclic creep induced ductile fatigue. This paper will review the modelling methods available to predict the lifetime of SnPb and SnAgCu solder joints under thermo‐mechanical cycling conditions such as power cycling, accelerated thermal cycling and isothermal testing, the methods do not apply to other damage mechanisms such as vibration or drop‐testing. Analytical methods such as recommended by the IPC are covered, which are simple to use but limited in capability. Finite element modelling methods are reviewed, along with the necessary constitutive laws and fatigue laws for solder, these offer the most accurate predictions at the current time. Research on state‐of‐the‐art damage mechanics methods is also presented, although these have not undergone enough experimental validation to be recommended at present.