| 红外焦平面探测器互连中的In缩球工艺 |
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| 引用本文： | 沈天铸. 红外焦平面探测器互连中的In缩球工艺[J]. 红外技术, 2007, 29(2): 96-98. DOI: 10.3969/j.issn.1001-8891.2007.02.009 |
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| 作者姓名： | 沈天铸 |
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| 作者单位： | 昆明物理研究所,云南,昆明,650223 |
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| 摘 要： | 铟缩球工艺对红外焦平面探测器的互连很有帮助.依据所做的实验叙述了铟缩球工艺的过程,论述了铟缩球工艺能提高铟柱高度,减小高度差,及减低焊接压力等优点.
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| 关 键 词： | 铟凸点 焦平面 互连 |
| 文章编号： | 1001-8891（2007）02-0096-03 |
| 修稿时间： | 2006-03-24 |
Indium Bump Reflow in Flip Chip Inter-connection of Infrared Focal Plane Array Detectors |
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| Indium Bump Reflow in Flip Chip Inter-connection of Infrared Focal Plane Array Detectors[J]. Infrared Technology , 2007, 29(2): 96-98. DOI: 10.3969/j.issn.1001-8891.2007.02.009 |
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| Authors: | SHEN Tian-zhu |
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| Affiliation: | Kunming Institute of Physics, Kunming Yunnan 650223 |
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| Abstract: | Indium Bump Reflow is a key technonogy flip chip for Inter-connection.The problems in indium bump reflow of flip chip inter-connection of Focal Plane Arrays are discussed.An optimized procedure for the indium bump reflow is shown. |
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| Keywords: | indium bump FPA inter-connection |
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