6H-SiC衬底上采用不同厚度AlN缓冲层对GaN外延层的影响

采用不同厚度AlN作为缓冲层在6H-SiC衬底上生长了GaN外延层，并利用X射线衍射，拉曼散射和透射电子显微镜等对GaN性质进行了研究。AlN缓冲层的应变状态对GaN的晶体质量和表面形貌有很大影响。较厚的AlN缓冲层会导致GaN表面出现裂纹，而太薄的AlN缓冲层会导致GaN层较高的位错密度，从而恶化器件性能。分析了GaN产生裂纹和高位错密度的机制，并采用较优厚度（100nm）的AlN缓冲层生长出高质量的GaN外延层。

Characteristics of GaN grown on 6H-SiC with different AlN buffers

Characteristics of GaN grown on 6H-SiC (0001) substrates using different thicknesses of AlN buffers are studied. It is found that the surface morphology and crystal quality of GaN film closely depends on the strain state of the AlN buffer. For a thicker AlN buffer, there are cracks on GaN surface, which make the GaN films unsuitable for applications. While for a thinner AlN buffer, more dislocations are produced in the GaN film, which deteriorates the performance of GaN. Possible generation mechanisms of cracks and more dislocations are investigated and a 100 nm AlN buffer is suggested to be a better choice for high quality GaN on SiC.