| 不同结构的PGA介绍 |
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| 引用本文： | 付花亮. 不同结构的PGA介绍[J]. 微纳电子技术, 1992, 0(6) |
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| 作者姓名： | 付花亮 |
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| 作者单位： | 机电部第13研究所 石家庄 |
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| 摘 要： | 本文简述了厚膜多层陶瓷结构、陶瓷-薄膜结构、陶瓷-铜-聚酰亚胺复合结构的PGA,并说明它们各自应用特点。
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| 关 键 词： | 集成电路 封装工艺 |
Review for PGA With Different Constructions |
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| Fu Hualiang. Review for PGA With Different Constructions[J]. Micronanoelectronic Technology, 1992, 0(6) |
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| Authors: | Fu Hualiang |
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| Abstract: | This paper briefly presents the PGA with different constructions, including thick-film multilayer ceramic construction,ceramic-thin film construction,and ceramic-copper-polyimide construction. It also describes individual applications for these kinds of PGA. |
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| Keywords: | IC Package process |
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