| 新型无铅焊料Sn-X-Cu-Ni的性能研究 |
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| 引用本文： | 杨磊,郭黎,揭晓华. 新型无铅焊料Sn-X-Cu-Ni的性能研究[J]. 热加工工艺, 2010, 39(3) |
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| 作者姓名： | 杨磊 郭黎 揭晓华 |
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| 作者单位： | 1. 广东工业大学,广东,广州,510006
2. 高新锡业(惠州)有限公司,广东,惠州516123 |
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| 基金项目： | 粤港关键领域重点突破招标项目 |
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| 摘 要： | 利用化学元素周期表上第VA族X元素和Ni元素代替Sn-Ag-Cu系列中的Ag制备出一种新型无铅焊料.用DSC测量了合金焊料的熔点,并考察了其润湿性和焊接接头强度,实验结果表明:Sn-X-Cu-Ni系新型合金焊料与Sn-Ag-Cu系和Sn-Cu系合金相比其润湿性和焊点剪切强度有明显的改善,焊点拉伸强度略有提高,但熔点有所升高.
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| 关 键 词： | 无铅焊料 润湿性 力学性能 |
Property of New Type Lead-free Solder Sn-X-Cu-Ni |
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| YANG Lei,GUO Li,JIE Xiaohua. Property of New Type Lead-free Solder Sn-X-Cu-Ni[J]. Hot Working Technology, 2010, 39(3) |
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| Authors: | YANG Lei GUO Li JIE Xiaohua |
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| Abstract: | Using periodic table of elements VA first group elements X,Ni took the place of Sn-Ag-Cu series Ag to prepare a new type of lead-free solder.The solder alloy melting pomt was measured with DSC,and its wettability and weld strength were investigated.The results show that compared with Sn-Ag-Cu system,and Sn-Cu system.the wettability and solder joints shear strength of Sn-X-Cu-Ni system significantly improves,slightly higher tensile strength of the solder joints,however,slightly higher melting point. |
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| Keywords: | lead-free solder wettability mechanical properties |
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