| 浅析环氧塑封料性能与器件封装缺陷 |
| |
| 引用本文： | 单玉来,李云芝. 浅析环氧塑封料性能与器件封装缺陷[J]. 电子工业专用设备, 2009, 38(4): 44-47 |
| |
| 作者姓名： | 单玉来 李云芝 |
| |
| 作者单位： | 汉高华威电子有限公司,江苏连云港,222006;汉高华威电子有限公司,江苏连云港,222006 |
| |
| 摘 要： | 简要介绍了环氧塑封料可靠性、流动性、内应力等性能及影响因素：对环氧塑封料与铜框架失效机理进行了分析，包括试验方法等内容，并对封装器件中产生的气孔、油斑问题，从环氧塑封料性能改进方面作了分析，这些都是为了保证最后成品的质量和可靠性，另外对其他器件封装缺陷也作了简要叙述．
|
| 关 键 词： | 环氧塑封料 性能 封装缺陷 |
Analysis on the Relation between EMC Property and Packaging Defect |
| |
| SHAN Yulai,LI Yunzhi. Analysis on the Relation between EMC Property and Packaging Defect[J]. Equipment for Electronic Products Marufacturing, 2009, 38(4): 44-47 |
| |
| Authors: | SHAN Yulai LI Yunzhi |
| |
| Affiliation: | (Henkel Huawei Electronics Co., Ltd. lianyungang 222006 China) |
| |
| Abstract: | This article gives a brief introduction on the EMC'S reliability, flow-ability and stress-ability, and other factors, the analysis in the EMC's property and copper's frame's property, testing method, and staining issue & void, etc. It also introduces how to improve the EMC's property in order to modify its reliability. Additionally, it expresses other kinds of defect's in packaging process. |
| |
| Keywords: | EMC Property Defect |
| 本文献已被 维普 万方数据 等数据库收录！ |
|
