双环氧基笼型倍半硅氧烷/氰酸酯树脂复合材料的制备与性能

以合成的双环氧基笼型倍半硅氧烷（EP-DDSQ）为改性剂，对双酚A型氰酸酯树脂（CE）进行改性，制备EP-DDSQ/CE复合材料。结果表明，EP-DDSQ加快了EP-DDSQ/CE复合材料的固化反应速率。当EP-DDSQ添加量为1wt%时，EP-DDSQ/CE复合材料冲击强度、弯曲模量和弯曲强度分别达到16.9 kJ/m2、123.6 MPa和3.37 GPa，比纯CE分别提高了80.5%、21.6%和14.0%，说明适量的EP-DDSQ能够同时提高EP-DDSQ/CE复合材料的韧性和强度。动态力学分析和热重分析结果表明，在EP-DDSQ添加适量时，EP-DDSQ/CE复合材料的玻璃化转变温度、初始分解温度和质量保持率有所提高，最大分解温度基本保持不变。介电性能分析结果表明，EP-DDSQ/CE复合材料的介电常数和介电损耗呈降低趋势，说明EP-DDSQ的加入赋予了EP-DDSQ/CE复合材料更优异的介电性能。 

Preparation and properties of diglycidyloxypropyloctaphenyl double-decker silsesquioxane/cyanate resin composites

The bisphenol A type cyanate resin (CE) was modified with diglycidyloxypropyloctaphenyl double-decker silsesquioxane (EP-DDSQ) as a modifier to prepare the EP-DDSQ/CE composite. The results show that EP-DDSQ accelerates the curing reaction rate of EP-DDSQ/CE composites. When the mass fraction of EP-DDSQ is 1wt%, the impact strength, flexural strength and flexural modulus of EP-DDSQ/CE composites are 16.9 kJ/m2, 123.6 MPa and 3.37 GPa, which are 80.5%, 21.6% and 14.0% higher than the pure CE, respectively, indicating that the proper amount of EP-DDSQ can simultaneously improve the toughness and strength of EP-DDSQ/CE composites. The thermogravimetric and dynamic mechanical analysis results show that the glass transition temperature, initial decomposition temperature and residual mass of the EP-DDSQ/CE composites increases with the addition of appropriate amount of EP-DDSQ, and the maximum decomposition temperature remains basically unchanged. The dielectric performance test results show that the dielectric constant and dielectric loss of EP-DDSQ/CE composites have a tendency to decrease, indicating that the addition of EP-DDSQ gives the EP-DDSQ/CE composites better dielectric properties.