Preparation and properties of particle reinforced Sn-Zn-based composite solder

Particle reinforced Sn-Zn based composite solders were obtained by adding Cu powders to Sn-9Zn melts. The microstructure analysis reveals that in situ Cu₅Zn₈ particles are formed and distributed uniformly in the composite solders. The strength and plasticity of the composite solders were improved, and creep resistance was considerably enhanced. The wettability of these composite solders is also better than that of Sn-9Zn. Funded by the Major Scientific and Technical Project Program of Jiangxi Province (No.2005008) and the Science & Technology Project of Education Department of Jiangxi Province (No.[2007]53 and No.GJJ09416)