大功率IGBT散热设计的模拟及实验研究

随着当代电子技术发展迅速,大功率电子产品的热流密度不断增长,体积在不断缩小。器件中心温度控制对其工作的可靠性具有重要影响,因此电子产品对冷却技术的要求更加严苛。针对某大功率器件IGBT模块的这些特点,利用Icepak建立原有产品的计算机模型,并用实验验证建立的可靠性。在此基础上,对铝制散热器结构和运行参数进行模拟优化分析。分析散热器肋片厚度、肋片高度及风量对于散热器热阻的影响,从而得出散热器的最佳设计方案。

Simulation and Experimental Investigation on the Thermal Design of High-power IGBT

With the rapid development of modern electronic technology nowadays, the heat flux density of high-power electronic products is growing while their volumes are diminishing. The control of temperature at the center of devices affects the reliability of their operations, therefore, more requirements are required for the cooling technology. In this paper, considering the above characteristics of an IGBT module in a high-power device, a computer model for the original product was established using Icepak, and its reliability was experimentally verified. On this basis, the aluminum heat-sink''s structure and operation parameters were simulated and optimized. By analyzing the effects on the heat-sink''s thermal resistance resulting from the fins'' thickness and height, as well as the air volume, an optimization scheme was obtained.