不同工作状态激光对可见光 CCD 的损伤实验

分别用连续激光、40 kHz 和5 kHz 重频激光对可见光 CCD 进行损伤实验,发现了相似的损伤现象,即点损伤、线状损伤和完全损伤,并分别测量了各个损伤状态下的驱动电极与衬底间的阻抗变化;分别对三组实验中损伤的 CCD 芯片进行电镜扫描,微观分析各个损伤位置处的损伤形貌,详细解释了出现三种损伤现象的原因,并比较了三种工作状态激光的不同作用机理.得到的结论是:点损伤现象与 CCD 表层的损伤有关,线损伤现象与漏光和电极间短路有关、完全损伤现象与绝缘层的损伤有关;连续激光作用的过程以热熔融为主、40 kHz 重频激光作用的过程以汽化烧蚀为主、5 kHz 重频激光作用的过程包括汽化烧蚀、强汽化“冲刷”以及反冲压力.

Experiment of Visible CCD Damaged by Laser Operating in Different State

The experiment that visible CCD was damaged by CW laser, 40 kHz laser and 5 kHz laser was carried out individually. Similar injury phenomenon was observed, which includes point damage, linear damage and complete damage. And the resistance between driving electrodes and substrate was measured corresponding to every injury state. Stereoscan photographs of the three damaged CCD slug were obtained to analyze the micromorphology of damaged positions. Through analysis, the causes of three different injury phenomenon were extracted and the different mechanism of CW laser, 40 kHz laser, 5 kHz laser irradiating CCD was discussed. The conclusion is that superficial injury causes point damage; light leakage and cutting out of driving electrodes lead to linear damage; and the injury of insulating barrier results in complete damage. Furthermore, fusion is the main process of CW laser irradiation; carburation and ablation are major causes of 40 kHz laser injuring CCD; and the factors of 5 kHz laser injuring CCD consist of carburation, ablation, eroding and recoil strength.