| 硅片沾污检测及清洗技术研究进展 |
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| 引用本文： | 林晓杰,王维升,刘汝刚.硅片沾污检测及清洗技术研究进展[J].微处理机,2012,33(3):7-10,16. |
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| 作者姓名： | 林晓杰 王维升 刘汝刚 |
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| 作者单位： | 1. 中国电子科技集团公司第四十七研究所,沈阳,110032
2. 沈阳硅基科技有限公司,沈阳,110169 |
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| 摘 要： | 主要阐述了硅片表面沾污测试技术中的一些重要研究进展,同时介绍了几种常见的硅片清洗方法,并对各方法的优点及适用性进行介绍。
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| 关 键 词： | 硅片 缺陷检测 湿法清洗 污染物 兆声波 |
The Progress in the Detection and Cleaning Technology of the Silicon Wafer |
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| LIN Xiao-jie
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WANG Wei-sheng
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LIU Ru-gang.The Progress in the Detection and Cleaning Technology of the Silicon Wafer[J].Microprocessors,2012,33(3):7-10,16. |
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| Authors: | LIN Xiao-jie WANG Wei-sheng LIU Ru-gang |
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| Affiliation: | LIN Xiao - jieI , WANG Wei - sheng2, LIU Ru - gang1 (1. The 47 th Research Institute of China Electronics Technology Group Corporation ,Shenyang 110032, China; 2. Shenyang Silicon Technology Co. ,Ltd. ,Shenyang 110169 ,China) |
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| Abstract: | This paper mainly expounds the significant developing of the contamination analysis tech- nology on the wafer surface. And it detailed introduces some important wafer clean laaethod and analyzes their advantage and applicability. |
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| Keywords: | Wafer Defect detection Wet - clean Contamination Megasonic |
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