Novel approach of twin-side thermal interfacing of integrated power modules for reduced thermal impedance

A novel approach of twin-side thermal interfaces of integrated power modules (IPM) is presented. This approach applies and improves commercially off-the-shelf products of IPM without significantly changing the original packaging design and manufacture's fabrication process. This approach can reduce the equivalent thermal impedance of the power module by about 20 %. It, in turn, reduces the p-n junction temperature rise of the power devices inside by 20 % at an equivalent load, thus being able to increase ambient operating temperatures, which is desirable for automotive applications. In addition, the weight and volume associated with conventional cooling mechanism can be reduced.