| 埋入电子元件基板的技术动向 |
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| 引用本文： | 蔡积庆.埋入电子元件基板的技术动向[J].印制电路信息,2003,19(10):44-48,64. |
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| 作者姓名： | 蔡积庆 |
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| 作者单位： | 南京无线电八厂 |
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| 摘 要： | 概述了埋入无源元件陶瓷基板,集成无源元件(IPD)硅基板,埋入无源部品或者无源部品和有源部品的树脂基板的技术动向。它适应于21世纪安装技术的革新。
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| 关 键 词： | 埋入无源元件基板 埋入无源·有源元件基板 安装技术 |
Technology Trend of Electronic Component Embedded Substrate |
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| Cai Jiqing.Technology Trend of Electronic Component Embedded Substrate[J].Printed Circuit Information,2003,19(10):44-48,64. |
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| Authors: | Cai Jiqing |
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| Abstract: | This paper is describes the technology trend of passive component embedded ceramic substrate, integrated passive device(IPD)Si substrate, passive Component embedded or passive and active component embedded resin substrate. It is suitable to revolutionization of mounting technology in 21th century. |
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| Keywords: | passive component embedded substrate passive and active component embeded substrate mounting technology |
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