| PCB电镀铜系统控制浅谈 |
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| 引用本文： | 杨晓新.PCB电镀铜系统控制浅谈[J].印制电路信息,2010(8):40-45. |
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| 作者姓名： | 杨晓新 |
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| 作者单位： | 汕头超声印制板公司,广东,汕头,515041 |
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| 摘 要： | 电镀铜是PCB加工过程中的一个关键工艺流程,涉及到孔和板面金属化的性能保证,影响因素众多。文章从系统控制角度出发,针对如何控制PCB电镀铜的各影响因素以保证电镀铜质量做了相关讨论。
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| 关 键 词： | 电镀铜 电镀管理 电镀工艺条件 系统控制 高低温循环 |
Talking about the Plating Copper System Control for PCB |
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| YANG Xiao-xin.Talking about the Plating Copper System Control for PCB[J].Printed Circuit Information,2010(8):40-45. |
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| Authors: | YANG Xiao-xin |
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| Affiliation: | YANG Xiao-xin |
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| Abstract: | The plating copper is a key process in the production of PCB, which involves the quality assurance of metallization of PTH holes and laminate surface, and is affected by a number of factors. This paper wants to introduce some effective methods of how to ensure the quality of plating copper by system controlling. |
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| Keywords: | plating copper plating technical management plating process conditions system control temperature cycling |
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