Moisture-induced delayed spallation and interfacial hydrogen embrittlement of alumina scales |
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Authors: | James L Smialek |
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Affiliation: | (1) NASA Glenn Research Center in Cleveland, Ohio |
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Abstract: | While interfacial sulfuris the primary chemical factor affecting Al2O3 scale adhesion, moisture-induced delayed spallation appears as a secondary, but impressive, mechanistic detail. Similarities
with bulk metallic phenomena suggest that hydrogen embrittlement from ambient humidity, resulting from the reaction Alalloy+3(H2O)air=Al(OH)−
3+3H+ may be the operative mechanism. This proposal was tested on pre-oxidized René N5 by standard cathodic hydrogen charging in
1N H2SO4, as monitored by weight change, induced current, and microstructure. Cathodic polarization at −2.0 V abruptly stripped mature
Al2O3 scales at the oxide-metal interface. Anodic polarization at +2.0V, however, produced alloy dissolution. Finally, with no
applied voltage, the acid electrolyte produced neither scale spallation nor alloy dissolution. Thus, hydrogen charging was
detrimental to alumina scale adhesion. Moisture-induced interfacial hydrogen embrittlement is concluded to be the cause of
delayed scale spallation and desktop thermal barrier coating failures. |
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