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基于GaAs基大功率激光器的热分析
引用本文:龚雪芹,冯士维,岳元,杨军伟,李经纬. 基于GaAs基大功率激光器的热分析[J]. 半导体学报, 2016, 37(4): 044011-5. DOI: 10.1088/1674-4926/37/4/044011
作者姓名:龚雪芹  冯士维  岳元  杨军伟  李经纬
作者单位:School of Electronic Information and Control Engineering, Beijing University of Technology
摘    要:The thermal characteristics of 808 nm Al Ga As/Ga As laser diodes(LDs) are analyzed via electrical transient measurements and infrared thermography. The temperature rise and thermal resistance are measured at various input currents and powers. From the electrical transient measurements, it is found that there is a significant reduction in thermal resistance with increasing power because of the device power conversion efficiency. The component thermal resistance that was obtained from the structure function showed that the total thermal resistance is mainly composed of the thermal resistance of the sub-mount rather than that of the LD chip, and the thermal resistance of the sub-mount decreases with increasing current. The temperature rise values are also measured by infrared thermography and are calibrated based on a reference image, with results that are lower than those determined by electrical transient measurements. The difference in the results is caused by the limited spatial resolution of the measurements and by the signal being captured from the facet rather than from the junction of the laser diode.

关 键 词:laser diodes  temperature rise  thermal resistance  electrical transient measurement  infrared thermography
收稿时间:2015-06-13
修稿时间:2015-09-21

Thermal analysis in high power GaAs-based laser diodes
Gong Xueqin,Feng Shiwei,Yue Yuan,Yang Junwei,Li Jingwei. Thermal analysis in high power GaAs-based laser diodes[J]. Chinese Journal of Semiconductors, 2016, 37(4): 044011-5. DOI: 10.1088/1674-4926/37/4/044011
Authors:Gong Xueqin  Feng Shiwei  Yue Yuan  Yang Junwei  Li Jingwei
Affiliation:School of Electronic Information and Control Engineering, Beijing University of Technology, Beijing 100124, China
Abstract:The thermal characteristics of 808 nm AlGaAs/GaAs laser diodes (LDs) are analyzed via electrical transient measurements and infrared thermography. The temperature rise and thermal resistance are measured at various input currents and powers. From the electrical transient measurements, it is found that there is a significant reduction in thermal resistance with increasing power because of the device power conversion efficiency. The component thermal resistance that was obtained from the structure function showed that the total thermal resistance is mainly composed of the thermal resistance of the sub-mount rather than that of the LD chip, and the thermal resistance of the sub-mount decreases with increasing current. The temperature rise values are also measured by infrared thermography and are calibrated based on a reference image, with results that are lower than those determined by electrical transient measurements. The difference in the results is caused by the limited spatial resolution of the measurements and by the signal being captured from the facet rather than from the junction of the laser diode.
Keywords:laser diodes  temperature rise  thermal resistance  electrical transient measurement  infrared thermography
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