| 聚合物基导热复合材料的研究进展 |
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| 引用本文： | 谢璠,齐暑华,李珺鹏,齐海元. 聚合物基导热复合材料的研究进展[J]. 中国胶粘剂, 2011, 20(9) |
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| 作者姓名： | 谢璠 齐暑华 李珺鹏 齐海元 |
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| 作者单位： | 西北工业大学理学院应用化学系,陕西西安,710072 |
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| 摘 要： | 阐述了聚合物基导热复合材料的导热机制。综述了国内外导热胶粘剂、导热橡胶和导热塑料等研究进展。介绍了提高复合材料导热性能的途径,并在此基础上,展望了聚合物基导热复合材料的应用前景和未来的发展方向。
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| 关 键 词： | 聚合物基复合材料 热导率 导热机制 导热填料 |
Research progress of polymer-based composites with thermal conductivity |
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| Xie Fan,Qi Shuhua,Li Junpeng,Qi Haiyuan. Research progress of polymer-based composites with thermal conductivity[J]. China Adhesives, 2011, 20(9) |
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| Authors: | Xie Fan Qi Shuhua Li Junpeng Qi Haiyuan |
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| Affiliation: | Xie Fan,Qi Shuhua,Li Junpeng,Qi Haiyuan (Department of Applied Chemistry,College of Science,Northwestern Polytechnical University,Xi'an 710072,China) |
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| Abstract: | The thermal conductivity mechanism of polymer-based composites with thermal conductivity was expounded.The research progresses of some materials such as thermal conductivity adhesives,rubber and plastic were summarized at home and abroad.The approach for improving thermal conductivity of composite was introduced.And on this basis,the application prospect and future development direction of polymer-based composite with thermal conductivity were expected. |
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| Keywords: | polymer-based composite thermal conductivity thermal conductivity mechanism thermal conductivity filler |
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