| Abstract: | In this paper the results of a finite‐element analysis of the electro‐thermal behaviour of an over‐current protection thick‐film hybrid module are presented. The module was designed for protecting the line card of a telephone network against an abnormal surge of current, resulting from accidental shorts between adjacent power feed lines. The switching time of the device is crucial to its effectiveness as a protective element. A transient finite‐element thermal analysis was performed in order to predict the dynamic temperature states at the critical points of the circuit design and to evaluate the influence on the switching characteristics. A comparison between simulated and practical results is given. Copyright © 2002 John Wiley & Sons, Ltd. |
