一种有效解决Cu CMP后残留二氧化硅颗粒的清洗液

摘要：在本文中提出了一种新型有效去除二氧化硅颗粒的FA/O清洗液，其主要成分包括FA/OII型螯合剂和FA/O型活性剂。这种清洗液能够同时去除以物理和化学吸附在晶圆表面的硅溶胶颗粒。 在本文实验过程中通过改变螯合剂和活性剂的浓度， 得出最佳清洗浓度。并且，讨论了这种FA/O碱性清洗剂去除硅溶胶颗粒的机理。根据实验结果可知，FA/OII型螯合剂和活性剂都能够有效去除硅溶胶颗粒。当FA/OII型螯合剂和FA/O活性剂达到最佳配比时，这种新型清洗液能够有效去除硅溶胶颗粒。

A novel cleaner for colloidal silica abrasive removal in post-Cu CMP cleaning

A novel cleaning solution, named FA/O alkaline cleaner, was proposed and demonstrated in the removal of colloidal silica abrasives.In order to remove both the chemical and physical absorbed colloidal silica abrasives, an FA/OII chelating agent and non-ionic surfactant were added into the cleaner.By varying the concentration of chelating agent and non-ionic surfactant, a series of experiments were performed to determine the best cleaning results.This paper discusses the mechanism of the removal of colloidal silica abrasives with a FA/O alkaline cleaner.Based on the experiment results, it is concluded that both the FA/OII chelating and non-ionic surfactant could benefit the removal of colloidal silica abrasives.When the concentration of FA/OII chelating agent and FA/O non-ionic surfactant reached the optima value, it was demonstrated that silica abrasives could be removed efficiently by this novel cleaning solution.