| SOP系列IC塑封工艺及通用MGP模具设计 |
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| 引用本文： | 曹阳根,李晓林,张恩霞,苗烨麟,舒珺,吴磊.SOP系列IC塑封工艺及通用MGP模具设计[J].半导体技术,2008,33(11). |
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| 作者姓名： | 曹阳根 李晓林 张恩霞 苗烨麟 舒珺 吴磊 |
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| 作者单位： | 上海工程技术大学,上海,201620;上海柏斯高模具有限公司,上海,200062 |
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| 摘 要： | 集成电路塑封对产品质量要求很高.传统的塑封模中几百个型腔只有一个注射头,各型腔成型工艺的差异较大,相应产品的合格率大约为96%.分析了相关IC塑封成型工艺,设计制造了一套SOP系列通用的多料筒MGP塑封模,该模具有28个注射头,每个注射头塑封20个(SOP14/16)的产品,大大减小了各型腔之间成型工艺的差距,并且通过更换不同模盒能够通用于SOP系列8、14、16三种不同产品的封装生产.经过制造和生产调试达到了设计的要求,产品合格率提高到99.9%.
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| 关 键 词： | 小外型封装 集成电路 通用 多注射头 塑封模 |
Design of Encapsulation Process and Universal MGP Mould for IC SOP Series |
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| Cao Yanggen,Li Xiaolin,Zhang Enxia,Miao Yelin,Shu Jun,Wu Lei.Design of Encapsulation Process and Universal MGP Mould for IC SOP Series[J].Semiconductor Technology,2008,33(11). |
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| Authors: | Cao Yanggen Li Xiaolin Zhang Enxia Miao Yelin Shu Jun Wu Lei |
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| Affiliation: | Cao Yanggen1,Li Xiaolin2,Zhang Enxia1,Miao Yelin1,Shu Jun1,Wu Lei1(1.Shanghai University of Engineering Science,Shanghai 201620,China,2.Shanghai Pascon Mould Co.Ltd.,Shanghai 200062,China) |
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| Abstract: | Demand of product QC for IC encapsulation is higher.Conventional IC encapsulation mould has only a single gate plunger and difference in molding process is obvious between each cavity.The products that up to grade only 96% around.IC encapsulation process was analyzed,one set of MGP encapsulation mould of universal for IC SOP series was designed.This mould has 28 gate plunger,20 products(SOP14/16)made by one gate plunger,the differences in molding process between each cavity greatly were decreased.The mould ... |
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| Keywords: | SOP IC universal MGP encapsulation mould |
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