Optimum film thickness of thin metallic coatings on silicon substrates for low load sliding applications |
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Authors: | Dong-Seob Jang Dae Eun Kim |
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Affiliation: | ∗Department of Mechanical Engineering, The Ohio State University, 206 West 18th Avenue, Columbus, OH 43210, USA;‡Department of Mechanical Engineering, Yonsei University, Seoul, Korea |
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Abstract: | The frictional behaviour of thin metallic films on silicon substrates sliding against 52100 steel balls is presented. The motivation of this work is to identify an optimum film thickness that will result in low friction under relatively low loads for various metallic films. Dry sliding friction experiments on silicon substrates with soft metallic coatings (silver, copper, tin and zinc) of various thickness (1–2000 nm) were conducted using a reciprocating pin-on-flat type apparatus under a controlled environment. A thermal vapour deposition technique was used to produce pure and smooth coatings. The morphology of the films was examined using an atomic force microscope, a non-contact optical profilometer and a scanning electron microscope. Following the sliding tests, the sliding tracks were examined by various surface characterization techniques and tools. The results indicate that the frictional characteristics of silicon are improved by coating the surface with a thin metallic film, and furthermore, an optimum film thickness can be identified for silver, copper and zinc coatings. In most cases ploughing marks could be found on the film which suggests that plastic deformation of the film is the dominant mode by which frictional energy dissipation occurred. Based on this observation, the frictional behaviour of thin metallic coatings under low loads is discussed and friction coefficients are correlated with an energy based friction model. |
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Keywords: | friction wear thin metallic films hard substrate thermal vapour deposition optimum film thickness |
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