| SIP封装工艺 |
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| 引用本文： | 王阿明,王峰. SIP封装工艺[J]. 电子与封装, 2009, 9(2): 11-15 |
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| 作者姓名： | 王阿明 王峰 |
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| 作者单位： | 中兴通讯有限公司,西安,710065;中兴通讯有限公司,西安,710065 |
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| 摘 要： | 系统级封装（SIP）技术从20世纪90年代初提出到现在，经过十几年的发展，已经被学术界和工业界广泛接受，成为电子技术研究新热点和技术应用的主要方向之一，并认为它代表了今后电子技术发展的方向，SIP封装工艺作为SIP封装技术的重要组成部分，这些年来在不断的创新中得到了长足的发展，逐渐形成了自己的技术体系，值得从事相关技术行业的技术人员和学者进行研究和学习，文章从封装工艺角度出发，对SIP封装制造进行了详细的介绍，另外也对其工艺要点进行了详细的探讨。
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| 关 键 词： | 封装工艺 表面处理 封装基板 |
SIP Packaging Technology |
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| WANG A-ming,WANG Feng. SIP Packaging Technology[J]. Electronics & Packaging, 2009, 9(2): 11-15 |
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| Authors: | WANG A-ming WANG Feng |
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| Affiliation: | (ZTE, Xi＇ an 710065, China) |
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| Abstract: | System-in-Packag(eSIP)technology from the early 1990s made up to now, after more than a decade of development, has extensive academic and industry acceptance and become the new hot technology and one of the major directions, it represents the future direction of the development of electronic technology, SIPpackaging technology as a SIPpackaging technology an important component,the years of constant in- novation has grown by leaps and bounds, and has gradually formed its own technology system, should be eng... |
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| Keywords: | packaging technology surface treatment package substrate |
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