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Heat-spreading analysis of a heat sink base embedded with a heat pipe
Authors:B V BORGMEYER  H B MA
Affiliation:Department of Mechanical and Aerospace Engineering, University of Missouri, Columbia, MO 65211, USA;
Abstract:A simplified model predicting the heat transfer performance of a heat sink base with a high thermal conductivity was developed. Numerical analysis was performed using the commercial software FLUENT. The investigation indicates that for heat sink bases with a high effective thermal conductivity, such as the base embedded with a typical heat pipe, the entire heat sink can be modeled as a flat plate with a uniform temperature and an effective convection heat transfer coefficient. This simplified model can be used to determine the heat transfer performance of a heat sink embedded with a typical heat pipe or vapor chamber.
Keywords:heat pipe  heat sink  microprocessor heat removal    
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