| BGA/CSP封装技术的研究 |
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| 引用本文： | 刘劲松,郭俭. BGA/CSP封装技术的研究[J]. 哈尔滨工业大学学报, 2003, 35(5): 602-604 |
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| 作者姓名： | 刘劲松 郭俭 |
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| 作者单位： | 日本爱立发有限公司,日本,长野县诹访市四贺2970-1,392-0012 |
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| 摘 要： | 从IC封装技术发展趋势的角度介绍了BCA／CSP封装理论和技术优势。阐述了植球机的基本构成和工作原理。植球机由印刷、搭载和检查工程3个工程组成。介绍了BCA／G6P封装型芯片的制造流程。指出：IC的BCA／CSP封装技术在高端比封装领域占主导地位，是未来发展的方向；致力于成为IC制造大国的中国，必须进行相关的技术理论研究。
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| 关 键 词： | BGA／CSP封装 植球机 IC 集成电路芯片 制作技术 |
| 文章编号： | 0367-6234(2003)05-0602-03 |
| 修稿时间： | 2002-09-09 |
BGA/CSP Packaging Techniques |
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| LIU Jin song,GUO Jian. BGA/CSP Packaging Techniques[J]. Journal of Harbin Institute of Technology, 2003, 35(5): 602-604 |
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| Authors: | LIU Jin song GUO Jian |
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| Abstract: | BGA/CSP packaging theory and its advantages in IC packaging field are discussed from the viewpoint of IC developing trend together with construction & principle of ball mounters. The ball mounting system proposed consists of three engineering processes Printing, Mounting & Inspection. It is pointed out that BGA/CSP packaging takes the leading position in the high-end IC packaging fields, and represents the future development trend of IC packaging. As a nation who makes every effort to be a large IC maker, China must study further its theory and development. |
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| Keywords: | IC package BGA/CSP ball mounter |
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