| 电路组装中的X-ray检测技术 |
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| 引用本文： | 鲜飞. 电路组装中的X-ray检测技术[J]. 电子工业专用设备, 2005, 34(9): 34-36,45 |
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| 作者姓名： | 鲜飞 |
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| 作者单位： | 烽火通信科技股份有限公司,湖北,武汉,430074 |
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| 摘 要： | 高密度封装技术的飞速发展也给测试技术提出了新挑战。为了应对挑战,新的测试技术不断涌现,X-ray检测技术就是其中之一,它能有效控制BGA的焊接和组装质量。介绍X-ray检测技术的原理及未来发展趋势。
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| 关 键 词： | X-ray检测 线路板 球栅阵列封装 电路组装 |
| 文章编号： | 1004-4507（2005）09-0034-03 |
| 收稿时间： | 2005-08-05 |
| 修稿时间： | 2005-08-05 |
X-ray Inspection Technology of Electronics Assembly |
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| XIAN Fei. X-ray Inspection Technology of Electronics Assembly[J]. Equipment for Electronic Products Marufacturing, 2005, 34(9): 34-36,45 |
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| Authors: | XIAN Fei |
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| Abstract: | The rapid development of high density packaging technology has already bring up the new challenge to testing technology. For replying challenge, the new testing technology continuously appears, X-ray inspection is one of them, it can be used to control quality of BGA soldering and assembly. This paper simply introduces the theory of automatic X-ray inspection, the development of it is also mentioned. |
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| Keywords: | X-ray Inspection PCB BGA Electronics Assembly |
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