Enhanced thermal conductivity of Cu matrix composites reinforced with Ag-coated β-Si3N4 whiskers |
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| Affiliation: | 1. National Physical Laboratory (CSIR), K.S. Krishnan Road, New Delhi 110 012, India;2. Department of Physics, Indian Institute of Technology Delhi, New Delhi 110 016, India;3. Advanced Technology Institute, University of Surrey, Guildford, GU2 7XH Surrey, United Kingdom;4. Department of Electronic Engineering, University of Surrey, Guildford GU2 7XH, Surrey, United Kingdom |
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| Abstract: | Cu matrix composites reinforced with 10 vol.% Ag-coated β-Si3N4 whiskers (ASCMMCs) were prepared by powder metallurgy method. With the aim of improving the thermal conductivity of the composites, a quite thin Ag layer was deposited on the surface of β-Si3N4 whiskers. The results indicated that thermal conductivity of ASCMMCs with 0.30 vol.% Ag (0.30ASCMMCs) reached up to 273 W m?1 K?1 at 25 °C, which was 98 W m?1 K?1 higher than that of Cu matrix composites reinforced with uncoated β-Si3N4 whiskers (USCMMCs). The Ag coating could promote the densification of composites, reduce the aggregation of β-Si3N4 whiskers and enhance the Cu/Si3N4 interfacial bonding, therefore it could efficiently enhance the thermal conductivity of Cu matrix composites reinforced with β-Si3N4 whiskers (SCMMCs). |
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| Keywords: | Metal matrix composites Powder metallurgy Microstructure Thermal |
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