A predictive model for interfacial thermal conductance in surface metallized diamond aluminum matrix composites |
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| Affiliation: | 1. College of Materials Science and Engineering, Hunan University, Changsha 410082, China;2. Hunan Province Key Laboratory for Spray Deposition Technology and Application, Hunan University, Changsha 410082, China;1. State Key Laboratory of Metal Matrix Composites, Shanghai Jiao Tong University, Shanghai 200240, China;2. Unité Matériaux et Transformations (UMET), CNRS UMR 8207, Université Lille 1, 59655 Villeneuve d''Ascq, France;3. School of Environmental Science and Engineering, Shanghai Jiao Tong University, Shanghai 200240, China;1. Department of Material Science and Engineering, Harbin Institute of Technology, Harbin 150001, China;2. Skate Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China;3. Heilongjiang Academy of Industrial Technology, Harbin 150001, China |
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| Abstract: | As promising thermal management materials with tailored thermal expansion and light weight, diamond/aluminum composites have not exhibited desirable thermal conductivity (TC) yet, due to poor interfacial thermal conductance (ITC) between diamond and aluminum. Although some experimental studies have been made to improve the ITC by means of diamond surface metallization, there are no systematic theoretical evaluations of the influences of interface layers’ structures on the ITC yet. In terms of the components of diamond/Al interface layer, a carbide–metal–intermetallic, multi-layered interface model was established in this work, and the effects of different components and structures of interface layers on the ITC and TC of the surface metallized diamond/Al composites were predicted. The calculated results indicate that, basically, an interface layer of nanoscale thickness with high TC and large sound velocity is desirable to achieve high ITC. Under this premise, W and Mo interface layers are proposed to be the most promising candidates to improve the thermal performance of diamond/Al composites. |
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| Keywords: | Metal–matrix composites Thermal properties Interface Modelling Interfacial thermal conductance |
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