Evaluation on diffusion bonded joints of TiAl alloy to Ti3SiC2 ceramic with and without Ni interlayer: Interfacial microstructure and mechanical properties |
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| Affiliation: | 1. State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China;2. Shandong Provincial Key Laboratory of Special Welding Technology, Harbin Institute of Technology at Weihai, Weihai 264209, China;1. Associazione EURATOM-ENEA sulla Fusione, via Enrico Fermi 45, 00044 Frascati, Rome, Italy;2. Fusion for Energy, c/ Josep Pla, 2 Torres Diagonal Litoral, 08019 Barcelona, Spain;1. Department of Dental Laboratory Science and Engineering, Korea University, Seoul 136-703, Republic of Korea;2. Department of Orthopaedics, Korea University Medical Center, Guro Hospital, Seoul 152-703, Republic of Korea;3. Department of Materials Science and Engineering, Seoul National University, Seoul, 151-742, Republic of Korea;1. Key Laboratory on Deep Geodrilling Technology of the Ministry of Land and Resources, China University of Geosciences, Beijing 100083, China;2. School of Materials Science and Technology, China University of Geosciences, Beijing 100083, China |
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| Abstract: | Diffusion bonding of TiAl alloys and Ti3SiC2 ceramics were carried out in a vacuum atmosphere. The microstructures and mechanical properties of the bonded joints were investigated. Results showed that three coherent intermetallic layers formed in the TiAl/Ti3SiC2 joints during bonding process. The compound layer adjacent to Ti3SiC2 substrate was indicated to be Ti5Si3, in which brittle fracture of the joints took place during shear strength test. The properties of diffusion bonded joints were greatly improved attributed to the formation of a good transition in the joint as well as the relief of the residual stress when using Ni foil as interlayer. Formation mechanisms of the compound layers during bonding process were discussed. Shear test results showed that the maximum shear strength reached 52.3 MPa. Corresponding fractograph indicated that the crack mainly propagated along Ti3SiC2 substrate adjacent to the bonding zone, accompanied with an intergranular and transgranular fracture mode. |
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| Keywords: | Diffusion bonding TiAl Microstructure Mechanical properties |
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