Morphology and growth kinetics of Ag3Sn during soldering reaction between liquid Sn and an Ag substrate |
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Authors: | T L Su L C Tsao S Y Chang T H Chuang |
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Affiliation: | (1) Department of Materials Science and Engineering, National Taiwan University, 106 Taipei, Taiwan |
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Abstract: | For the soldering of recycled Ag sputtering targets, the interfacial reaction between liquid Sn and an Ag substrate at temperatures
ranging from 250 –425°C has been investigated. Experimental results show that a scallop-shaped layer of Ag3Sn intermetallic compounds formed during the soldering reaction. Kinetics analysis indicated that the growth of such interfacial
Ag3Sn intermetallic compounds is diffusion-controlled with activation energy of 70.3kJ/mol. During the reaction, the Ag substrate
dissolves into the molten Sn solder and causes the appearance of needle-shaped Ag3Sn precipitates in the Sn matrix. |
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Keywords: | Ag3Sn intermetallic compound interfacial reaction kinetic analysis target bonding |
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