Cure kinetics of an epoxy resin containing naphthyl/dicyclopentadiene moieties and bis‐phenoxy (3‐hydroxy) phosphine oxide system and properties of its cured polymer |
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| Authors: | Hua Ren Jianzhong Sun Qian Zhao Cai Zhiqi Qincai Ling Qiyun Zhou |
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| Affiliation: | 1. State Key Laboratory of Chemical Engineering, Department of Chemical and Biochemical Engineering, Zhejiang University, Hangzhou 310027, China;2. College of Material Science and Engineering, Nanjing University of Aeronautics and Astronautics, Nanjing 211100, China |
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| Abstract: | The cure kinetics of naphthyl/dicyclopentadiene epoxy resin and bisphenoxy (3‐hydroxy) phosphine oxide was investigated by differential scanning calorimetry (DSC) under nonisothermal and isothermal condition. The advanced isoconversional method was used to study the nonisothermal DSC data, the effective activation energy of the curing system in the early stage agreed with the value calculated from the Kissinger model and then increased because of the hindrance of molecular mobility. Autocatalytic behavior was shown in the isothermal DSC measurement, which was well described by Kamal model in the early curing stage. In the later stage, a crosslinked network structure was formed and the curing reaction was mainly controlled by diffusion. The diffusion factor was introduced to optimize the Kamal model and correct the deviation of the calculated data. The physical properties of the cured polymer were evaluated by dynamic mechanical thermal analyses, thermogravimetric analyses, and limiting oxygen index test, which exhibited relatively high glass transition temperature, thermal stability, and flame retardancy. © 2009 Wiley Periodicals, Inc. J Appl Polym Sci, 2009 |
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| Keywords: | epoxy resin bisphenoxy (3‐hydroxy) phosphine oxide cure kinetics |
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