Flexible Electronics: Ultrathin Silicon Circuits With Strain‐Isolation Layers and Mesh Layouts for High‐Performance Electronics on Fabric,Vinyl, Leather,and Paper (Adv. Mater. 36/2009) |
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| Authors: | Dae‐Hyeong Kim Yun‐Soung Kim Jian Wu Zhuangjian Liu Jizhou Song Hoon‐Sik Kim Yonggang Y. Huang Keh‐Chih Hwang John A. Rogers |
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| Affiliation: | 1. Department of Materials Science and Engineering Beckman Institute for Advanced Science and Technology and Frederick Seitz Materials Research Laboratory University of Illinois at Urbana‐Champaign Urbana, Illinois 61801 (USA);2. Department of Civil and Environmental Engineering Northwestern University Evanston, IL 60208 (USA);3. Department of Mechanical Engineering Northwestern University Evanston, IL 60208 (USA);4. Institute of High Performance Computing 1 Fusionopolis Way, #16‐16 Connexis 138632 Singapore (Singapore);5. Department of Mechanical and Aerospace Engineering University of Miami Coral Gables, FL 33146 (USA);6. FML, Departments of Engineering Mechanics Tsinghua University Beijing, 100084 (P. R. China);7. Department of Chemistry Beckman Institute for Advanced Science and Technology and Frederick Seitz Materials Research Laboratory University of Illinois at Urbana‐Champaign Urbana, Illinois 61801 (USA);8. Department of Mechanical Science and Engineering Beckman Institute for Advanced Science and Technology and Frederick Seitz Materials Research Laboratory University of Illinois at Urbana‐Champaign Urbana, Illinois 61801 (USA);9. Department of Electrical and Computer Engineering Beckman Institute for Advanced Science and Technology and Frederick Seitz Materials Research Laboratory University of Illinois at Urbana‐Champaign Urbana, Illinois 61801 (USA) |
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| Abstract: | |
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| Keywords: | flexible electronics nanomaterials nanomechanics plastic electronics semiconductor stretchable electronics |
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