Electroless copper plating on acrylonitrile butadiene styrene material surfaces without chromic acid etching and a palladium catalyst |
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Authors: | Norihiro Inagaki Hajime Kimura |
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Affiliation: | Laboratory of Polymer Chemistry, Faculty of Engineering, Shizuoka University, 3‐5‐1 Johoku, Hamamatsu 432‐8561, Japan |
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Abstract: | Hydrolysis modification of nitrile groups on acrylonitrile butadiene styrene (ABS) plate surfaces into carboxylic acid groups was investigated to find a new recipe for electroless copper plating of ABS plate surfaces without etching reactions using chromic acid and also without a palladium catalyst. Hydrolysis modification of nitrile groups was successfully conducted in an aqueous sodium hydroxide (NaOH) solution (70 wt %) at 80°C for more than 72 h, and nitrile groups were modified into carboxylic acid groups. The hydrolysis modification was accelerated by the addition of dioxane as a supplement to the aqueous NaOH solution. The modification, when an aqueous mixture solution of NaOH (35 wt %) and dioxane (10 wt %) was used as a reagent, was accomplished at 65°C in 30 min. The hydrolyzed ABS plate surfaces were successfully metalized by electroless copper plating. A silver catalyst, instead of a palladium catalyst, was usable in the electroless copper‐plating process. Adhesion between the deposited copper metal and ABS plate surface was perfect for the Scotch tape test. Consequently, we propose a new recipe for an electroless copper‐plating process without an etching process using chromic acid and without a palladium catalyst. © 2008 Wiley Periodicals, Inc. J Appl Polym Sci, 2009 |
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Keywords: | adhesion ESCA/XPS FT‐IR metal‐polymer complexes surfaces |
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