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直流反应磁控溅射法制备氮化钛薄膜
引用本文:付淑英,柳碧清,胡祥青.直流反应磁控溅射法制备氮化钛薄膜[J].中国材料科技与设备,2009,6(3):60-61.
作者姓名:付淑英  柳碧清  胡祥青
作者单位:[1]新余高等专科学校,江西新余338031 [2]景德镇高等专科学校物理系,江西景德镇333000
基金项目:江西省新余市2008年自然科学基金项目(2008zrbxjj03);新余高专科研项目(xj0747)
摘    要:研究了采用直流反应磁控溅射法制备TiN薄膜的工艺条件。研究发现:在保持其它工艺参数不变的条件下,溅射的TiN薄膜在不同温度区域存在的物相不同,薄膜的主要成分是多晶立方相TiN,240℃附近是薄膜择优取向由(111)向(200)转变的临界点。随着基底温度升高,薄膜表面粗糙度先变小后变大,沉积最佳基底温度值是330℃,该温度下薄膜的粗糙度最小,膜层致密均匀,没有大尺寸缺陷且光洁度好。

关 键 词:氮化钛薄膜  磁控溅射  基底温度  反射率

DC Reactive Magnetron Sputtering TiN Film
FU Shu-ying,LIU Bi-qing,HU Xiang-qing.DC Reactive Magnetron Sputtering TiN Film[J].Chinese Materials Science Technology & Equipment,2009,6(3):60-61.
Authors:FU Shu-ying  LIU Bi-qing  HU Xiang-qing
Affiliation:1. Xinyu College. Jiangxi,Xinyu, 338031,China; 2. Dept. of phy. Jingdezhen College Department of Physics. Jiangxi,Jingdezhen,333000,China)
Abstract:This paper studies the use of DC reactive magnetron sputtering TiN film processing conditions. The study found: In the other process parameters remain unchanged under the conditions of sputtering of TiN films at different temperature regions of different phase of existence, the main component of thin films are polycrystalline cubic phase TiN, 240 ℃ preferred orientation near the film are from (111) to (200) changes the critical point. With the substrate temperature increases, the film surface roughness become smaller after the first large, the best substrate deposition temperature are 330 ℃, the temperature of the roughness of the smallest thin-film, uniformly dense layer, there is no large-size defects and finish well.
Keywords:Titanium nitride film  Magnetron sputtering  Basal temperature  Reflectivity
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