芯片散热复合材料的制备及其性能研究

本论文设计了一种新型的复合材料,由发泡硅胶、导热层和绝缘层三部分组成.通过发泡工艺制备了发泡硅胶,然后在其外层依次包覆导热层及绝缘层,从而得到芯片散热复合材料.并对制备的芯片复合材料进行导热性能、压缩性能、剥离强度表征.

Preparation and performance of die heat composite materials

This paper designs a new kind of composite material, which consists of three parts: foamed silicone, conductive layer and insulating layer. The foamed silica gel was prepared by foaming process, and then it was coated with heat and insulation layer in order to obtain the composite material of the chip. The thermal conductivity, compression performance and stripping intensity are characterized by the preparation of composite composite materials.