| 常压歧化铜粉的物理与化学性能研究 |
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| 引用本文： | 余仲兴,周邦娜,孙驰,黄奇,陈世琯. 常压歧化铜粉的物理与化学性能研究[J]. 有色金属材料与工程, 2000, 21(3): 105-111 |
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| 作者姓名： | 余仲兴 周邦娜 孙驰 黄奇 陈世琯 |
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| 作者单位： | 上海大学,材料科学及工程学院,上海,200072 |
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| 摘 要： | 本文就采用常压歧化法制得的微细铜粉的形貌、颗粒线尺寸、粒度分布、松装密度、摇实密度、化学成分、抗氧化性能，及其在烧结过程中的行为等物理与化学性能进行了测定与探讨。结果表明，在优化条件下所得微细铜粉性能完全符合电子浆料用铜粉的要求。
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| 关 键 词： | 电子浆料 常压歧化铜粉 物理性质 化学性能 |
Investigation on Physical and Chemical C haracteristics of Copper Powder Prepared by Disproportionation under Normal Pre ssure |
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| Yu Zhong-xing,ZHOU Bang-na,SUN Chi,HUANG Qi,CHEN Shi-guan. Investigation on Physical and Chemical C haracteristics of Copper Powder Prepared by Disproportionation under Normal Pre ssure[J]. Nonferrous Metal Materials and Engineering, 2000, 21(3): 105-111 |
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| Authors: | Yu Zhong-xing ZHOU Bang-na SUN Chi HUANG Qi CHEN Shi-guan |
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| Abstract: | In this paper were measured and discussed the physical and chemical characteristics,such as morphology,particle size and its range,loose and packing density,impurity content,resistance to oxidation as well as behavior in sintering process of fine copper powder prepared by disproportionation under normal pressure.The experimental results show that the fine copper powder prepared under optimum condition meets well the requirement for production of conductive ink. |
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| Keywords: | fine copper powder conductive ink disproportionation electronic material |
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