基于TRIZ解决航空航天用吸波贴片成本高的问题

目的 解决隐身飞机在飞行过程中因吸波贴片自身过重产生巨大的飞行成本,吸波贴片在飞行条件下易产生划痕、损伤、材料损耗快,以及因修复工序复杂、耗时长产生大量维护费用等问题。方法 应用TRIZ理论进行分析求解,通过采用功能模型分析、因果分析等找到航空航天用吸波贴片成本高的关键缺陷,利用技术矛盾分析、物理矛盾分析、物场模型及标准解、小人法等工具得到多个解决方案。经过综合评估最终找到经济、易于实现的解决方案。结果 通过运用TRIZ理论,并且通过综合评价找到了减少吸波贴片成本的最优方案：吸波贴片中的吸波体由掺杂杂原子的石墨烯构成了多孔结构,增加了其吸波性能;再将材料与自愈合材料相结合,增加其自愈能力,从而得到吸波性能好、质量小、自愈合能力强的吸波贴片。结论 文中得出的结果对减少隐身战机吸波贴片成本的研究具有一定的理论指导意义,有助于减少高集成设备过多对人类及环境产生的危害。

Solution to Problem of High Cost of Microwave Absorbing Patches for Aerospace Based on TRIZ

The work aims to solve the problems of the huge flight cost caused to the stealth aircraft by the excessive weight of the microwave absorbing patch, the easy scratches, damage and fast material loss of the microwave absorbing patch under flight conditions and the complex repair process, long time and a large amount of maintenance costs. The TRIZ theory was applied to analyze and solve the problems. The key defects for the high cost of the microwave absorbing patch for aerospace were found by functional model analysis and causality analysis. Then, several solutions were obtained by technical contradiction analysis, physical contradiction analysis, material field model and standard solution, small man method and other tools. After comprehensive evaluation, an economical solution easy to implement was found. By TRIZ theory and comprehensive evaluation, the optimal scheme to reduce the cost of the microwave absorbing patch was found. The absorbing body of the microwave absorbing patch was composed of a porous structure of graphene doped with heteroatoms, which increased its absorbing performance. Then, the material was combined with the self-healing material to increase its self-healing ability, so as to obtain the microwave absorbing patch with good absorbing performance, small weight and strong self-healing ability. The research results have a certain theoretical significance to reduce the cost of microwave absorbing patch in stealth aircraft, which is helpful to reduce the harm to human and environment caused by highly integrated devices.