Correlation between hardness and stress in Al-(Nb, Mo, Ta) thin films |
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Authors: | T. Car N. Radi? M. ?ekada |
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Affiliation: | a Rudjer Boškovi? Institute, Division of Materials Science, Bijeni?ka cesta 54, 10000 Zagreb, P.O.B. 1016, Croatia b Jo?ef Štefan Institute, Ljubljana, Slovenia c Department of Physics, Bijeni?ka cesta 32, 10000 Zagreb, P.O.B. 331, Croatia |
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Abstract: | The thin films of AlxNb1 − x (95 ≥ x ≥ 20), AlxMox (90 ≥ x ≥ 20) and AlxTa1 − x (95 ≥ x ≥ 20) were prepared by magnetron codeposition at room temperature. The average film thickness was from 325 to 400 nm, depending on the film composition. The structure of the as-deposited films was examined by the X-ray diffraction. The stress of the films was determined from the substrate deformation by the profilometer, and the microhardness (load 2 mN) was examined by the micro- and nano-hardness device. For the purpose of the examination of the hardness, the samples were deposited onto the sapphire wafers, while the examination of the film stress, was performed by using thin glass substrates. For all the Al-(Nb, Mo, Ta) alloy compositions, the microhardness is predominantly under the influence of the harder element, and monotonically decreases with the increase of the aluminum content. However, the microhardness of the amorphous AlTa films was higher than the bulk value of a harder element (Ta) in the alloy. A simple empirical linear relationship between the Vickers hardness, the bulk value hardness of the transition metal (harder element) and the elastic energy fraction of the identation deformation, was established. The elastic energy fraction in the microhardness is also linearly correlated with the stress in films. |
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Keywords: | Magnetron sputtering X-ray diffraction Codeposition Metal films Hardness Stress |
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