| 氯甲基笼型倍半硅氧烷改性双酚A环氧树脂性能 |
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| 引用本文： | 谭军,王华金,沙宝祥,韦晓燕,俞强.氯甲基笼型倍半硅氧烷改性双酚A环氧树脂性能[J].化工学报,2013,64(11):4269-4273. |
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| 作者姓名： | 谭军 王华金 沙宝祥 韦晓燕 俞强 |
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| 作者单位： | 1. 嘉兴学院生物与化学工程学院, 浙江 嘉兴 314001;
2. 嘉兴学院材料与纺织工程学院, 浙江 嘉兴 314001;
3. 常州大学材料科学与工程学院, 江苏 常州 213164 |
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| 基金项目： | 嘉兴市科技计划项目(2009AY2003,2012AY1025);国家自然科学基金项目(20906038)~~ |
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| 摘 要： | 引言双酚A环氧树脂是目前应用最广、用量最大的环氧树脂,具有良好的化学稳定性、电气绝缘性被广泛应用于涂料和电子电器等领域;然而,双酚A环氧树脂存在耐热性较差和固化后脆性大等缺点,因此如何提高环氧树脂的耐热性及力学性能等是目前改性研究的热点之一1-5]。而笼型多面体倍半硅氧烷(POSS)是一类具有(RSiO1.5)n通式的纳米材料,因其特殊的分子组成结构使得POSS具
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| 关 键 词： | 氯甲基倍半硅氧烷 环氧树脂 固化反应 热性能 力学性能 |
| 收稿时间： | 2013-05-06 |
| 修稿时间： | 2013-07-21 |
Properties of biphenyl A epoxy resin modified by choromethyl polyhedral silsesquioxane |
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| TAN Jun;WANG Huajin;SHA Baoxiang;WEI Xiaoyan;YU Qiang.Properties of biphenyl A epoxy resin modified by choromethyl polyhedral silsesquioxane[J].Journal of Chemical Industry and Engineering(China),2013,64(11):4269-4273. |
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| Authors: | TAN Jun;WANG Huajin;SHA Baoxiang;WEI Xiaoyan;YU Qiang |
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| Affiliation: | 1. School of Biological and Chemical Engineering, Jiaxing University, Jiaxing 314001, Zhejiang, China;
2. School of Materials and Textile Engineering, Jiaxing University, Jiaxing 314001, Zhejiang, China;
3. School of Materials Science and Engineering, Changzhou University, Changzhou 213164, Jiangsu, China |
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| Abstract: | Hybrid epoxy resin composite materials were prepared from choromethyl polyhedral silsesquioxane(CM-POSS),bisphenol epoxy(E-51),MeTHPA and TEA.The curing reaction of hybrid epoxy,and mechanical and thermal properties of the cured epoxy were characterized by Fourier transform infrared spectroscopy(FT-IR),differential scanning calorimetry(DSC),thermogravimetric analysis(TGA)and heat distortion temperature tester.CM-POSS was connected in cross-linked epoxy resin system by chemical reaction in the curing reaction process.Thermal properties,tensile,bending and impact strengthes of the cured hybrid resin were improved with increased content of CM-POSS.Addition of CM-POSS could make the Tg and rigidity of epoxy resin increase but had little effect on tenacity. |
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| Keywords: | chloromethyl polyhedral silsesquioxane epoxy resin curing reaction thermal properties mechanical properties |
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