| Ag颗粒增强复合钎料钎焊接头蠕变断裂及强化机理研究 |
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| 引用本文： | 闫焉服,纪莲清,张柯柯,贺俊光,赵丹娜.Ag颗粒增强复合钎料钎焊接头蠕变断裂及强化机理研究[J].材料科学与工艺,2009,17(3):418-421. |
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| 作者姓名： | 闫焉服 纪莲清 张柯柯 贺俊光 赵丹娜 |
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| 作者单位： | 闫焉服,张柯柯,贺俊光,赵丹娜,YAN Yan-fu,ZHANG Ke-ke,HE Jun-guang,ZHAO Dan-na(河南科技大学,材料科学与工程学院,洛阳,471003);纪莲清,JI Lian-qing(郑州轻工业学院,机电工程学院,郑州,450002) |
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| 基金项目： | 河南省科技攻关项目，河南科技大学校基金 |
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| 摘 要： | 测定了不同应力和温度下Ag颗粒增强复合钎料及基体钎料63Sn37Pb钎焊接头蠕变寿命,分析了Ag颗粒增强复合钎料及基体钎料钎焊接头蠕变断裂机理.表明:Ag颗粒增强复合钎料钎焊接头蠕变寿命优于基体钎料;Ag颗粒表面Ag-Sn金属间化合物形成及Ag颗粒对富Pb层阻碍作用是复合钎料钎焊接头蠕变性能提高的主要因素;钎焊接头Cu基板上一薄层富Pb相区形成是蠕变裂纹主要原因.
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| 关 键 词： | Ag颗粒 复合钎料 蠕变寿命 蠕变断裂 蠕变强化机理 |
Creep rupture and enhancement mechanism of Ag particle-enhancement composite solder joints |
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| YAN Yan-fu,JI Lian-qing,ZHANG Ke-ke,HE Jun-guang,ZHAO Dan-na.Creep rupture and enhancement mechanism of Ag particle-enhancement composite solder joints[J].Materials Science and Technology,2009,17(3):418-421. |
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| Authors: | YAN Yan-fu JI Lian-qing ZHANG Ke-ke HE Jun-guang ZHAO Dan-na |
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| Affiliation: | YAN Yan-fu1,JI Lian-qing2,ZHANG Ke-ke1,HE Jun-guang1,ZHAO Dan-na1 (1.School of Materials Science , Engineering,Henan University of Science , Technology,Luoyang 471003,China,2.School of Mechatronics Engineering,Zhengzhou University of Light Industry,Zhengzhou 450002,China) |
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| Abstract: | The creep rupture lifetimes of Ag particle enhancement SnPb based composite solder joints and matrix solder joints were respectively tested under different temperatures and stresses,and the creep rupture mechanism was analyzed.The creep resistance of the composite solder joints is superior to that of the matrix solder joints.The Cu6Sn5 intermetallic compound layer formed between the matrix and the counteract of Ag particles to creep behavior are the main reasons for the high creep resistance of the composit... |
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| Keywords: | Ag particles composite solder creep rupture life creep rupture creep enhancement mechanism |
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