| 低应力化学沉铜浅析 |
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| 引用本文： | 张亚平,杨之诚,孔令文,杨智勤.低应力化学沉铜浅析[J].印制电路信息,2010(8):35-39. |
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| 作者姓名： | 张亚平 杨之诚 孔令文 杨智勤 |
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| 作者单位： | 深南电路有限公司,广东,深圳,518117 |
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| 摘 要： | 文章简述了低应力化学沉铜的工艺特点,通过简单的对比实验分析了其与传统化学沉铜的不同,以期加深读者对低应力化学沉铜工艺的理解。
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| 关 键 词： | 低应力化学沉铜 ABF 抗剥强度 |
The Simple Analysis of SAP Electroless Copper Process |
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| ZHANG Ya-ping,YANG Zhi-cheng,KONG Ling-wen,YANG Zhi-qin.The Simple Analysis of SAP Electroless Copper Process[J].Printed Circuit Information,2010(8):35-39. |
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| Authors: | ZHANG Ya-ping YANG Zhi-cheng KONG Ling-wen YANG Zhi-qin |
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| Affiliation: | ZHANG Ya-ping YANG Zhi-cheng KONG Ling-wen YANG Zhi-qin |
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| Abstract: | This article introduced the properties of techniques of the SAP electroless copper process briefly, and analyzed the differences between SAP and traditional techniques of electroless copper process by simple comparative experiment to deepen the reader’s understanding of the SAP electroless copper process. |
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| Keywords: | ABF |
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