| 利用钛过渡层及掺钼改善声表面波器件用铝薄膜的微结构与性能 |
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| 引用本文： | 李冬梅,王旭波,潘峰.利用钛过渡层及掺钼改善声表面波器件用铝薄膜的微结构与性能[J].稀有金属,2005,29(5):742-746. |
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| 作者姓名： | 李冬梅 王旭波 潘峰 |
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| 作者单位： | 1. 清华大学材料科学与工程系,先进材料教育部重点实验室,北京,100084;新疆大学化学化工学院,新疆,乌鲁木齐,830046
2. 清华大学材料科学与工程系,先进材料教育部重点实验室,北京,100084 |
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| 基金项目： | 国家高技术（863）计划课题（2002AA325040）和教育部重大科技项目（0303） |
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| 摘 要： | 纯铝薄膜以其低声阻抗特性被广泛应用于声表面波（SAW）器件的制作。随着通讯频率的不断提高，对SAW器件用Al薄膜的功率承受力以及与基体的附着力提出了越来越高的要求。采用少量易于反应离子刻蚀的Mo元素掺杂来改善Al合金的抗电迁移和功率承受力，并以数纳米的Ti过渡层增强Ao-Mo合金薄膜的取向性。结果表明：Ti／Al-Mo薄膜表现出强（111）织构，与纯Al薄膜相比，晶粒明显细化且致密均匀，临界载荷大大增加，与基体的附着力显著增强，并具有良好的刻蚀性能。
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| 关 键 词： | Al-Mo薄膜 Ti过渡层 附着力 声表面波 |
| 文章编号： | 0258-7076（2005）05-0742-05 |
| 收稿时间： | 2005-07-31 |
| 修稿时间： | 2005-07-312005-08-20 |
Improved Microstructure and Properties of Al Films Used in High-Frequency SAW Devices by Mo Additive and Ti Underlayer |
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| Li Dongmei,Wang Xubo,Pan Feng.Improved Microstructure and Properties of Al Films Used in High-Frequency SAW Devices by Mo Additive and Ti Underlayer[J].Chinese Journal of Rare Metals,2005,29(5):742-746. |
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| Authors: | Li Dongmei Wang Xubo Pan Feng |
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| Affiliation: | 1. Laboratory of Advanced Materials, Department of Materials Science and Engineering, Tsinghua University, Beifing 100084, China; 2. Institute of Chemistry and Chemical Engineering, Xinfiang University, Urumuqi 830046, China |
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| Abstract: | Al films are widely used in surface acoustic wave(SAW) devices because of their low acoustic impedance.With increasing the frequency of SAW devices,both high power durability and strong adhesion of Al films are required.Mo additive was used to improve the anti-electromigration and power durability of Al films.A Ti underlayer of 10 nm thickness was used to enhance the orientation of the Al-Mo films.The results indicate that highly oriented Al(111) texture is developed on the Ti underlayer.The Ti/Al-Mo films decrease grain size and show dense and uniform surface compared with the pure Al films.The critical load and adhesion to the LiNbO_3 substrates of the Ti/Al-Mo films are largely increased.The Ti/Al-Mo films are also easily etched in reactive ion etching. |
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| Keywords: | Al thin films Ti underlayer Adhesion SAW |
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