Development of creep-resistant,nanosized Ag particle-reinforced Sn-Pb composite solders |
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| Authors: | J P Liu F Guo Y F Yan W B Wang Y W Shi |
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| Affiliation: | (1) The Key Laboratory of Advanced Functional Materials of Ministry of Education, College of Materials Science and Engineering, Beijing University of Technology, 100022 Beijing, The People’s Republic of China |
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| Abstract: | The physical properties, solderability, and creep-rupture life of the nanosized Ag particle-reinforced Sn-Pb composite solder
were investigated. The experimental results indicate that the composite solder possesses good electrical conductivity as well
as good solderability. Compared to the eutectic 63Sn-37Pb solder matrix, the nanosized Ag particle-reinforced composite solder
improved the creep resistance and significantly enhanced the creep-rupture life of its solder joints. The fracture surface
revealed a mixture of ductile and brittle fracture features. |
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| Keywords: | Nanosized composite solder solderability creep-rupture life |
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