| PP化学镀Ni-Cu-P导电粉末及其涂覆ABS板电磁屏蔽性能研究 |
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| 引用本文： | 刘继光,陈奎儒. PP化学镀Ni-Cu-P导电粉末及其涂覆ABS板电磁屏蔽性能研究[J]. 工程塑料应用, 2006, 34(8): 54-56 |
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| 作者姓名： | 刘继光 陈奎儒 |
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| 作者单位： | 西南科技大学制造科学与工程学院,绵阳,621010;西南科技大学制造科学与工程学院,绵阳,621010 |
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| 摘 要： | 选用轻质聚丙烯(PP)粉末作芯材,在其表面化学镀覆Ni-Cu-P合金,制备出复合导电粉末并进行了测试。针对PP化学稳定性好、憎水性强的特点,采用了特殊的镀前处理方法。使用该导电粉末制备导电涂料并对(丙烯腈/丁二烯/苯乙烯)共聚物(ABS)板进行涂覆,对其电磁屏蔽性能进行测试。结果表明,PP粉末镀层表面质量良好、电阻率较低,镀层电阻率随镀层中铜含量增加而降低;涂料涂覆的ABS板的电磁屏蔽性能较好。
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| 关 键 词： | 聚丙烯 化学镀 Ni-Cu-P 导电粉末 电磁屏蔽 |
| 收稿时间： | 2006-05-22 |
| 修稿时间： | 2006-05-22 |
STUDY ON THE PREPARATION OF A COMPOUND ELECTRIC POWDER OF ELECTROLESS NI-CU-P PLATING ON POLYPROPYLENE AND THE ELECTROMAGNETIC SHIELDING EFFECTIVENESS OF ITS COATING ABS PLATE |
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| Liu Jiguang,Chen Kuiru. STUDY ON THE PREPARATION OF A COMPOUND ELECTRIC POWDER OF ELECTROLESS NI-CU-P PLATING ON POLYPROPYLENE AND THE ELECTROMAGNETIC SHIELDING EFFECTIVENESS OF ITS COATING ABS PLATE[J]. Engineering Plastics Application, 2006, 34(8): 54-56 |
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| Authors: | Liu Jiguang Chen Kuiru |
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| Affiliation: | Department of Manufacture Science and Engineering, Southwest University of Science and Technology, Mianyang 621010, China |
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| Abstract: | A compound electric powder of electroless Ni-Cu-P plating on polypropylene was prepared. By using special pretreating method before plating aiming at the characteristics of good chemical stability and hydrophobic behavior of PP. A coating was made with the compound electric powder. A Painted ABS plate was prepared and the electromagnetic shielding effectiveness of the coating was tested. Results showed that the plating coat of the material had good surface quality and low resistivity, the resistivity of plating coat decreased with the increasing of the content of copper. The painted ABS plate had good electromagnetic shielding effectiveness. |
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| Keywords: | polypropylene electroless plating Ni-Cu-P electric powder electromagnetic shielding |
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