| 埋嵌元件PCB的技术 |
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| 引用本文： | 蔡积庆[译]. 埋嵌元件PCB的技术[J]. 印制电路信息, 2013, 0(6): 47-53 |
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| 作者姓名： | 蔡积庆[译] |
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| 作者单位： | 江苏南京,210018 |
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| 摘 要： | 概述了埋嵌元件PCB的元件互联技术,埋嵌元件PCB的评价解析和今后的展望。
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| 关 键 词： | 埋嵌元件PCB 安装技术,评价解析 展望 |
Technology of Device Embedded PCB |
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| CAI Ji-qing. Technology of Device Embedded PCB[J]. Printed Circuit Information, 2013, 0(6): 47-53 |
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| Authors: | CAI Ji-qing |
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| Affiliation: | CAI Ji-qing |
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| Abstract: | This paper describes device interconnection technology employed in device embedded PCB, evaluation and analysis of device embedded PCB and its prospects. |
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| Keywords: | Device Embedded PCB Mounting Technology Evaluation and Analysis Prospect. |
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