埋嵌子板的HDI板制作工艺研究

通过对埋嵌子板高密度互连结构PCB中局部混压工艺难点进行分析，对铣槽精度控制、子母板偏移、板面流胶及阻胶方法控制等进行研究，通过试验评估了不同定位方式、不同开槽补偿方式、不同阻胶排板方式及边缘刮铜等设计，找出了工艺难点的有效解决方法，完善了埋嵌子板高密度互连结构PCB制作工艺，经批量生产应用，验证了该工艺可行性。

Manufacturing research of HDI with the embedded daughter board

In this paper, we study the process technology about partial-hybrid board in HDI with the embedded daughter board; At first, we analyze the technical difficult issues in the process, and do some research and evaluation experiments including researching the routing-cavity accuracy, researching the mother-daughter board mis-registration, researching the resin flow on the board surface, and reducing the resin on the board surface; evaluating the different position tolerance, the different ways of routing-cavity, the different lay up, and clearance design on the routing edge copper. Through the researching and evaluating, we find the ways to solve the process dit＇ficult issues; to improve the technology. And through manufacturing mass production, we verified that the partial- hybrid board technologies are OK.