印制电路板埋入平面薄层电阻研究

近年来高速、高性能电子产品骤增，对应高密度的同时，还要对应高频、高速传输，因此，电路板的表面封装需要转换到埋置元件PCB上来。不受寄生元件或者噪音影响，而又能高速地传输大容量的信号的关键影响因素在于电阻。文章以Ohmega公司生产的NI—P薄层电阻材料作为研究对象，通过实验发现在整个制作过程中，酸性蚀刻、碱性蚀刻、棕化、硫酸铜缸蚀刻对电阻精度均有一定的影响，其中酸性蚀刻和碱性蚀刻在整个加工过程中影响最大。通过对以上加工过程中的参数进行控制研究，得到精度较高的电阻阻值，为印制电路板埋入电阻阻值的控制提供了参考。

Printed circuit board embedded plane sheet resistance research

In recent years, high speed, high performance electronic products surge. We have to not only cope with high density, high frequency, but also high speed transmission. Therefore, circuit board surface packaging needs to switch to embedded component PCB. It should not be affected by parasitic element or noise, and has high speed transmission capacity of the signal. The key factors are in resistance. This paper takes Ohmega company production of NI-P sheet resistance material as the research object, and through the experiment, it discovered the entire production process, the acid etching, alkaline etching, brown oxide changed, copper sulfate cylinder etching precision of resistance all have certain effect. The acid etching and alkaline etching in the whole process of had the biggest influence. Based on the above process parameters control research, we got high accurate resistance value for printed circuit board embedded technology value control which will provide certain reference value.