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PCB AOI检测中微小缺陷成像分析与检测
引用本文:邹美芳,金刚.PCB AOI检测中微小缺陷成像分析与检测[J].印制电路信息,2013(5):18-20.
作者姓名:邹美芳  金刚
作者单位:北京凌云光视数字图像技术有限公司,北京100195
摘    要:自动光学检测(AOI)已成为PCB检测的主要方式,线路板微小缺陷检测对于AOI系统是严峻的挑战。研究线路板微小缺陷的成像问题。运用成像理论,研究了欠采样条件下微小缺陷的成像特点,分析了缺陷尺寸与像素分辨率的比例及采样相位对成像的影响,并进行了实验验证。该研究对PCB AOI系统的设计和检测性能分析有重要意义。

关 键 词:线路板检测自动光学检测  欠采样成像  微小缺陷检测

Inspection of small size defect in PCB AOI
ZOU Mei-fang,JIN Gang.Inspection of small size defect in PCB AOI[J].Printed Circuit Information,2013(5):18-20.
Authors:ZOU Mei-fang  JIN Gang
Affiliation:ZOU Mei-fang JIN Gang
Abstract:Automatic Optical Inspection technology has been widely applied to control the quality of PCB. It's a serious problem to inspect small size defect by PCB AOI system. In this paper, we analyze the pattern of under-sampling imaging in PCB AOI. The relationship of three factors, defect's size, pixel resolution and sampling phase, are studied. The experiment result is presented. It's important to the design ofPCB AOI.
Keywords:Print Circuit Board Inspection  Automatic Optical Inspection  Under-Sampling Imaging
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