Stress analysis of multi-layer electronic and mechanical systems (MEMS) under fatigue and impact loading conditions |
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| Authors: | Rasha Mohamed Soliman Medhat Awad El-Hadek Shaban Ibrahim Abdu |
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| Affiliation: | (1) Department of Mechanical Design and Production, Faculty of Engineering at Port-Said, Port-Fouad, Port-Said University, Port-Said, Egypt; |
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| Abstract: | Detailed micro electronic and mechanical systems (MEMS) for a mobile microprocessor complex shape were modeled using Finite
Element (FE) processing. Fatigue and impact conditions were performed on the Ball Grid Array (BGA) Integrated Circuit (IC)
using Abaqus\CAE finite element analysis software. The main objective of this research is to make sure that BGA products can
endure the roughness of the daily usage, where a portable electronic product is habitually coupled with potential damage of
functional failure when the device falls. |
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