Creep mechanisms in beryllium

Observations of beryllium samples which have been creep tested between 922 K and 1422 K indicate that creep behavior is controlled by the relative strengths of the grain boundaries and the matrix. Since creep deformation can occur predominantly by grain boundary sliding or entirely by deformation within the grains, the creep strength was found to be controlled by the weaker of the two features. Low melting phases containing aluminum and silicon which formed along the grain boundaries acted as stress concentrations which favored localized grain boundary deformation, and recrystallization. Creep resistance was found to drop markedly when the BeO content was reduced substantially below 1 pct.